Many years of practical experience with equipment
In fact, in recent years, from graphite heat dissipation to heat pipe heat dissipation, and now to temperature equalization board heat dissipation, mobile phone heat dissipation technology has been constantly updated. According to industry insiders, the power of 4G chips is 1W-2W, and high thermal conductivity graphite materials are sufficient to solve problems such as local overheating and space limitations faced by mobile phones. The maximum power of 5G chips will reach 5W-7W. With the increase of chip power consumption and changes in mobile phone structure (foldable screen), high thermal conductivity graphite materials are no longer able to meet the heat dissipation needs of mobile phones.
Among the various heat dissipation solutions for 5G mobile phones, the temperature equalization board, as a new way to solve the heat dissipation problem of mobile phones, has gradually become the main demand and industry trend in the 5G era with its unique heat dissipation effect. In the 5G flagship phones released earlier this month, the Huawei Mate 20 X and Samsung Galaxy S10 both use temperature equalization plates for their cooling systems.
As one of the few in the country Ultra thin VC temperature plate etching machine The manufacturer, Huazhou Machinery, is recruiting a team of experienced uniform temperature plate corrosion technicians to establish a presence in the domestic and international markets, especially in the East China VC heat dissipation plate etching market. By utilizing years of accumulated metal etching technology and the efforts of experienced temperature equalization plate etching technicians, we provide detailed and professional consulting, production, and after-sales services to customers in various industries Ultra thin VC hot plate etching machine Overall solution.